Tokuyama Bond force II
Tokuyama Bond force II
Tokuyama Bond force II
Tokuyama Bond force II
Tokuyama Bond force II
Tokuyama Bond force II

TOKUYAMA

Tokuyama Bond force II

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Product Description

TOKUYAMA Bond Force II, as a high-performance 7th generation adhesive material, offers a reliable solution in dentistry. Thanks to its self-etching formulation and patented SR monomer, this product creates a three-dimensional (3D) network structure to provide strong and long-lasting adhesion on enamel and dentine.



Indications

Bond Force II can be effectively used for bonding light-cured or dual-cure composite materials. It is particularly preferred for repairs of fractured porcelain or composite on cut or uncut enamel and dentine.



Benefits

This adhesive offers simple and quick application while delivering superior bonding strength. Effective results are achieved with just one application; it does not require acid etching or rinsing, making the application process even easier. It also supports dental health by releasing fluoride and provides excellent adaptation with a thin film layer (8μm). Its formulation, which re Show More

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